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A significant step forward in Odisha's semiconductor ambitions. Intel Corporation, 3DGS Inc., and the Government of Odisha signed an MoU on May 28, 2026 at Intel’s headquarters in Santa Clara, to explore the establishment of a world-class Advanced Semiconductor Glass Core Packaging Substrate Manufacturing Facility in Odisha, marking a historic step in building India's future semiconductor, AI, and digital infrastructure capital.

June 01, 2026

A significant step forward in Odisha's semiconductor ambitions. Intel Corporation, 3DGS Inc., and the Government of Odisha signed an MoU on May 28, 2026 at Intel’s headquarters in Santa Clara, to explore the establishment of a world-class Advanced Semiconductor Glass Core Packaging Substrate Manufacturing Facility in Odisha, marking a historic step in building India's future semiconductor, AI, and digital infrastructure capital.
A significant step forward in Odisha's semiconductor ambitions. Intel Corporation, 3DGS Inc., and the Government of Odisha signed an MoU on May 28, 2026 at Intel’s headquarters in Santa Clara, to explore the establishment of a world-class Advanced Semiconductor Glass Core Packaging Substrate Manufacturing Facility in Odisha, marking a historic step in building India's future semiconductor, AI, and digital infrastructure capital.
A significant step forward in Odisha's semiconductor ambitions. Intel Corporation, 3DGS Inc., and the Government of Odisha signed an MoU on May 28, 2026 at Intel’s headquarters in Santa Clara, to explore the establishment of a world-class Advanced Semiconductor Glass Core Packaging Substrate Manufacturing Facility in Odisha, marking a historic step in building India's future semiconductor, AI, and digital infrastructure capital.
A significant step forward in Odisha's semiconductor ambitions. Intel Corporation, 3DGS Inc., and the Government of Odisha signed an MoU on May 28, 2026 at Intel’s headquarters in Santa Clara, to explore the establishment of a world-class Advanced Semiconductor Glass Core Packaging Substrate Manufacturing Facility in Odisha, marking a historic step in building India's future semiconductor, AI, and digital infrastructure capital.
Ambassador Shri Vinay Mohan Kwatra noted: "This initiative marks an important milestone in advancing the vision articulated by Prime Minister Narendra Modi and President Donald J. Trump during the Prime Minister's visit to Washington, D.C., in February 2025, for collaboration between the two countries in advanced manufacturing under the US-India TRUST (Transforming Relationship Utilising Strategic Technology) Initiative."

Underscoring India's strategic vision, Union Minister Shri Ashwini Vaishnaw stated: "This initiative reflects India's larger vision of strengthening domestic manufacturing capabilities and positioning the country as a global economic powerhouse."
Reflecting Odisha's transformational ambitions, Chief Minister Shri Mohan Charan Majhi said: "Today marks the beginning of a new chapter in Odisha's growth story. This initiative goes beyond semiconductor manufacturing — it is about creating a future where Odisha becomes a globally competitive destination for advanced technologies, innovation, AI infrastructure, data centers, and digital transformation. Our vision is to build a vibrant ecosystem that inspires future generations, creates world-class opportunities for our youth, attracts leading global technology companies, and firmly places Odisha on the global semiconductor map. This is a transformational, generational opportunity that will accelerate economic growth, strengthen India's technological self-reliance, and position Odisha at the forefront of the global digital economy."

The ceremony was also addressed by Dr. Mukesh Mahaling, Minister, Electronics & IT, Health and Family Welfare and Parliamentary Affairs; Chief Secretary Smt. Anu Garg, who led the Odisha delegation; MeitY Secretary Shri S. Krishnan; Shri Vishal Kumar Dev, Additional Chief Secretary, Dept. of Electronics & IT; and Intel CEO Mr. Lip-Bu Tan.
Consul General Dr. K. Srikar Reddy was part of this momentous occasion.